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Full support for Fan-Out, 2.5D/3D packaging technologies and metal fine etching — high-resolution, high-accuracy direct imaging for substrate-level advanced packaging.
Values depend on model configuration
Substrate-level packaging processes supported
Fine-line direct imaging for RDL of fan-out packages
Exposure for interposer, silicon bridge and stacked substrates
Precision patterning with auto scale compensation
Exposure for fine-line metal etching, roll & sheet
Recommended models: DPX606S / DPX812S
| Item | DPX606S | DPX812S |
|---|---|---|
| Platform type | Patterning Single platform | Patterning Single platform |
| Applications | Substrate, HDI, FPC | HDI, FPC, PCB |
| Number of lenses | 6 | 8 |
| Wavelength | 405 nm | 405 nm |
| Max exposure area | 535×635 mm | 535×635 mm |
| MP resolution | L/S = 12/12 μm | L/S = 30/30 μm |
| Outer layer alignment accuracy | ±5 μm | ±8 μm |
| Inner layer alignment accuracy | 10 μm | 16 μm |
| Throughput | 1.5 sides/min 420×520mm @50 mj/cm² | 2.2 sides/min 535×610mm @50 mj/cm² |
| Line width tolerance | ±10% | ±10% |
| DOF | ±80 μm | ±100 μm |
| Scale mode | Fixed scale / Auto scale / Interval scale / Partition alignment | |
| File format | Gerber274x / ODB++ | |
| Equipment size | 2765×1720×2145 mm | 2905×1894×1793 mm |
| Equipment weight | 4.5 T | 5 T |
GIS Graphic Technology Co., Ltd.
+86 199 5132 0170 · +86 (0)512-66579218 · mk@gis-group.com.cn
