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Multi-wavelength solder mask direct imaging: 365/385/405/425 nm, bridge 30 µm / opening 50 µm (DPX712SSME), with patterning-solder-mask integrated model.
Values depend on model configuration
Full parameters of all 3 models
| Item | DPX630TSM | DPX218SM | DPX712SSME |
|---|---|---|---|
| Platform type | Solder mask Dual platform | Patterning solder mask integrated Single platform | Multi wavelength solder mask Single platform |
| Applications | FPC, PCB | HDI, PCB | HDI, FPC, PCB |
| Number of lenses | 6 | 2 | 7 |
| Wavelength | 365 / 405 / 425 nm | 365 / 405 / 425 nm | 365 / 385 / 405 / 425 nm |
| Max exposure area | 624×730 mm | 624×730 mm | 630×730 mm |
| MP resolution | Solder mask bridge: 75 μm Solder mask opening: 120 μm | L/S = 35/35 μm | Solder mask bridge: 30 μm Solder mask opening: 50 μm |
| Outer layer alignment accuracy | ±12 μm | ±8 μm | ±8 μm |
| Inner layer alignment accuracy | / | 16 μm | / |
| Throughput | 3.5 sides/min @500 mj/cm² 2 sides/min @1000 mj/cm² 720×620mm | 200 pnl/h @400 mj/cm² 130 pnl/h @1500 mj/cm² @120×120mm, 16 panels | 1.5 sides/min @500 mj/cm² 1 side/min @1000 mj/cm² 730×630mm |
| Line width tolerance | ±10% | ±10% | ±10% |
| DOF | ±300 μm | ±150 μm | ±120 μm |
| Scale mode | Fixed scale / Auto scale / Interval scale / Partition alignment | ||
| File format | Gerber274x / ODB++ | ||
| Equipment size | 3000×1948×2290 mm | 2400×1150×2170 mm | 2765×1720×2145 mm |
| Equipment weight | 5 T | 2.3 T | 4.5 T |
DPX630TSM @500–1000 mj/cm²; DPX218SM 16 panels @120×120mm; DPX712SSME @500–1000 mj/cm²
GIS Graphic Technology Co., Ltd.
+86 199 5132 0170 · +86 (0)512-66579218 · mk@gis-group.com.cn
