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High-precision patterning for HDI, IC substrates, and advanced packaging — single & dual platform, 5 models from ceramic substrates to volume production.
Values depend on model configuration
Full parameters of all 5 models
| Item | DPX812S | DPX820T | DPX725T | DPX606S | DPX325S |
|---|---|---|---|---|---|
| Platform type | Patterning Single platform | Patterning Dual platform | Patterning Dual platform | Patterning Single platform | Patterning Single platform |
| Applications | HDI, FPC, PCB | HDI, FPC, PCB | FPC, PCB | Substrate, HDI, FPC | HDI, PCB |
| Number of lenses | 8 | 8 | 7 | 6 | 3 |
| Wavelength | 405 nm | 405 nm | 405 nm | 405 nm | 405 nm |
| Max exposure area | 535×635 mm | 624×730 mm | 624×810 mm | 535×635 mm | 624×730 mm |
| MP resolution | L/S = 30/30 μm | L/S = 35/35 μm | L/S = 40/40 μm | L/S = 12/12 μm | L/S = 40/40 μm |
| Outer layer alignment accuracy | ±8 μm | ±8 μm | ±10 μm | ±5 μm | ±8 μm |
| Inner layer alignment accuracy | 16 μm | 16 μm | 20 μm | 10 μm | 16 μm |
| Throughput | 2.2 sides/min 535×610mm @50 mj/cm² | 5 sides/min 535×610mm @50 mj/cm² | 6 sides/min 620×720mm @50 mj/cm² | 1.5 sides/min 420×520mm @50 mj/cm² | 40 sides/h @410×520mm @500 mj/cm² |
| Line width tolerance | ±10% | ±10% | ±10% | ±10% | ±10% |
| DOF | ±100 μm | ±150 μm | ±250 μm | ±80 μm | ±200 μm |
| Scale mode | Fixed scale / Auto scale / Interval scale / Partition alignment | ||||
| File format | Gerber274x / ODB++ | ||||
| Equipment size | 2905×1894×1793 mm | 2905×1894×2183 mm | 2905×1894×2183 mm | 2765×1720×2145 mm | 2400×1150×2170 mm |
| Equipment weight | 5 T | 5 T | 5 T | 4.5 T | 2.3 T |
GIS Graphic Technology Co., Ltd.
+86 199 5132 0170 · +86 (0)512-66579218 · mk@gis-group.com.cn
