GIS Laser technology plays a crucial role in improving production efficiency and reducing costs.

When high precision is required in PCB manufacturing, GIS Laser technology plays a crucial role in improving production efficiency and reducing costs.

High precision manufacturing: PCB manufacturing typically involves very intricate circuit patterns that require high precision manufacturing processes to ensure the performance and stability of the circuits. Traditional photolithography mask manufacturing processes may lead to pattern misalignment or blurring issues. GIS Laser technology, on the other hand, exposes patterns directly on the photoresist using lasers, achieving micron-level precision, ensuring accuracy and consistency of patterns.

Cost reduction in manufacturing: Traditional PCB manufacturing processes involve creating photolithography masks, which not only require additional time and labor costs but also expensive equipment and materials. GIS Laser technology eliminates this manufacturing step by directly exposing patterns on the PCB using digital design files, saving manufacturing costs and reducing waste production.

Rapid adaptation to design changes: PCB designs may change frequently, requiring manufacturing processes that can quickly adapt to different design requirements. Traditional photolithography mask manufacturing processes require significant time and cost to produce new masks to accommodate design changes. GIS Laser technology can directly expose new patterns on the PCB based on the new design files, greatly enhancing manufacturing flexibility and response speed.

Increased production efficiency: Due to its high speed and precision, GIS Laser technology significantly improves PCB manufacturing efficiency. Compared to traditional photolithography mask manufacturing processes, GIS Laser technology can complete pattern exposure more quickly, achieve higher production throughput, shorten manufacturing cycles, and enhance production efficiency.

High resolution and precision: GIS Laser's LDI equipment can achieve a minimum line width and spacing of 7 microns, with conventional products reaching 10 microns, demonstrating excellent resolution and precision. This means the equipment can create finer circuit patterns, meet the requirements of complex PCB designs, and ensure manufacturing quality and stability.

High exposure speed: Some models of GIS Laser's LDI equipment can achieve exposure speeds of up to 7200 pieces per day, enabling efficient production, shortening manufacturing cycles, and increasing production efficiency. This feature is particularly crucial for large-scale PCB manufacturers.

Wide range of applications: GIS Laser's LDI equipment is suitable not only for conventional PCB materials like HDI boards and FPC boards but also for handling various materials and processes such as roll-to-roll materials, solder mask, carrier boards, ceramic substrates, lead frames, among others. This high flexibility and adaptability make the equipment capable of meeting the needs of different industries and customers.